Title:
電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
Document Type and Number:
Japanese Patent JP6795296
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield film and an electromagnetic wave shield film-attached printed wiring board, each including an insulative resin layer having flame retardancy, in which the worsening of the heat resistance and surface hardness of the insulative resin layer is suppressed.SOLUTION: An electromagnetic wave shield film 1 comprises: an insulative resin layer 10; and a conductive layer 20 adjacent to the insulative resin layer 10. The insulative resin layer 10 has: a first insulative resin layer 12 making an outermost layer on the side opposite to the conductive layer 20 in the insulative resin layer 10; and a second insulative resin layer 14 different from the first insulative resin layer 12. The flame retardant content (mass%) in the first insulative resin layer 12 (100 mass%) is lower than that (mass%) in the second insulative resin layer 14 (100 mass%).SELECTED DRAWING: Figure 1
Inventors:
Kazuyoshi Yoshida
Minoru Kubota
Tsutomu Saga
Minoru Kubota
Tsutomu Saga
Application Number:
JP2015224712A
Publication Date:
December 02, 2020
Filing Date:
November 17, 2015
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
H05K9/00; B32B27/00; B32B27/18; H05K1/02
Domestic Patent References:
| JP2006319216A | ||||
| JP2015192073A | ||||
| JP2013216749A | ||||
| JP2005161778A |
Foreign References:
| CN101056531A |
Attorney, Agent or Firm:
Nishizawa Kazumi
Yuichiro Kawagoe
Shunsuke Fushimi
Yuichiro Kawagoe
Shunsuke Fushimi