Title:
熱伝導性エポキシ樹脂封止用組成物
Document Type and Number:
Japanese Patent JP6798414
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing excellent in flowability, narrow gap intrusion property, electric insulation property and heat conductivity, in particular, for mold underfill material.SOLUTION: A composition for heat conductive epoxy resin sealing contains an inorganic filler which simultaneously satisfies (1) a top cut diameter by a wet sieve method of 7 μm or more and 25 μm or less, (2) a particle size distribution measurement value obtained by measuring particles having a larger top cut diameter on a volume basis by a laser diffraction method of 2 vol.% or less, and (3) an average particle diameter of 1-10 μm, and a non-conductive metal oxide-based black pigment.SELECTED DRAWING: None
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Inventors:
Sora Oishi
Shoichi Nagata
Yokota Ryuhei
Shoichi Nagata
Yokota Ryuhei
Application Number:
JP2017093729A
Publication Date:
December 09, 2020
Filing Date:
May 10, 2017
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/00; C08K3/22; H01L23/29; H01L23/31
Domestic Patent References:
| JP2014152302A | ||||
| JP2015071670A | ||||
| JP2016044208A | ||||
| JP2015216229A | ||||
| JP2010037352A |
Foreign References:
| WO2010073559A1 |
Attorney, Agent or Firm:
Ushiki International Patent Office
Mamoru Ushiki
Mamoru Ushiki