Title:
無色銅含有材料
Document Type and Number:
Japanese Patent JP6799548
Kind Code:
B2
Abstract:
Aspects of this disclosure pertain to a colorless material that includes a carrier, copper-containing particles, and either one or both of sodium thiocyanate and titanium dioxide. In one or more embodiments, the material exhibits, in the CIE L*a*b* system, an L* value in the range from about 91 to about 100, and a C* value of less than about 7, wherein C* equals √(a∗2+ b∗2). In some embodiments, the material exhibits a greater than 3 log reduction in a concentration of Staphylococcus aureus, under the EPA Test Method for Efficacy of Copper Alloy as a Sanitizer testing conditions.
Inventors:
Lahili, joydeep
Lynn, Jeffrey Glenn
Florie Christine Monique
Lynn, Jeffrey Glenn
Florie Christine Monique
Application Number:
JP2017566689A
Publication Date:
December 16, 2020
Filing Date:
June 22, 2016
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
A01N59/20; A01P3/00; C09D5/14; C09D7/61; C09D201/00
Domestic Patent References:
| JP48056971A |
Foreign References:
| WO2014132606A1 |
Attorney, Agent or Firm:
Yanagita Seiji
Hideaki Takahashi
Hideaki Takahashi