Title:
フラックス用揺変剤並びにこれを含むフラックス及びソルダペースト
Document Type and Number:
Japanese Patent JP6801879
Kind Code:
B2
Abstract:
Provide are: a thixotropic agent which contains a heat sagging inhibitor that has been made evenly and rapidly dispersible and as a result of this configuration, which, when added to a flux or solder paste, causes no thermal damage to the flux resin or the heat sagging inhibitor and which prevents the flux or solder paste from thermally sagging; and a flux and a solder paste each containing the thixotropic agent. The thixotropic agent of the present invention comprises a mixture of: an amide wax that is a product of condensation of at least one acid selected from among saturated aliphatic monocarboxylic acids, hydroxylated aliphatic monocarboxylic acids, and polybasic acids with at least one amine selected from among diamines and tetramines; a resin having a molecular weight of 10,000 at most; and a dispersion medium having a boiling point of at least 180ºC. The flux and the solder paste of the present invention each contain this thixotropic agent.
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Inventors:
Nobuaki Nakatsuka
Takanori Matsuyama
Masayuki Kinukawa
Takanori Matsuyama
Masayuki Kinukawa
Application Number:
JP2017545172A
Publication Date:
December 16, 2020
Filing Date:
October 06, 2016
Export Citation:
Assignee:
Kyoeisha Chemical Co., Ltd.
International Classes:
B23K35/363
Domestic Patent References:
| JP2012086269A | ||||
| JP2005144520A | ||||
| JP7075894A | ||||
| JP2003010997A | ||||
| JP201436985A |
Attorney, Agent or Firm:
Patent business corporation Maku patent office