Title:
部品供給装置
Document Type and Number:
Japanese Patent JP6802387
Kind Code:
B2
Abstract:
A component supply device including: a stage configured such that electronic components are scattered on the stage; a contacting section provided at a height so as to contact the electronic components on the stage; a slide device configured to relatively slide the stage and the contacting section; a dropping opening configured to allow the electronic components scattered on the stage that have been caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall provided at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop, wherein the contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.
Inventors:
Tatsu Matsumoto
Go Hamane
Sugihara Akira
Go Hamane
Sugihara Akira
Application Number:
JP2019542905A
Publication Date:
December 16, 2020
Filing Date:
September 22, 2017
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/02
Domestic Patent References:
| JP5009541A | ||||
| JP54130291U | ||||
| JP56073571U |
Foreign References:
| WO2016071984A1 | ||||
| WO2016092658A1 |
Attorney, Agent or Firm:
Patent business corporation NEXT
Yasutaka Fukatsu
Yuki Kataoka
Yasutaka Fukatsu
Yuki Kataoka