Title:
裏面入射型固体撮像素子
Document Type and Number:
Japanese Patent JP6803137
Kind Code:
B2
Abstract:
A back-illuminated solid-state imaging element includes a semiconductor substrate which has a front surface and a back surface provided with a recess, and in which a thinned section, which is a bottom section of the recess, is an imaging area, a signal read-out circuit formed on the front surface of the semiconductor substrate, a boron layer formed on at least the back surface of the semiconductor substrate and a lateral surface of the recess, a metal layer formed on the boron layer, and provided with an opening opposing a bottom surface of the recess, and an anti-reflection layer formed on the bottom surface of the recess.
Inventors:
Masaharu Muramatsu
Hisanori Suzuki
Yasuto Yoneda
Shinya Otsuka
Hirotaka Takahashi
Hisanori Suzuki
Yasuto Yoneda
Shinya Otsuka
Hirotaka Takahashi
Application Number:
JP2015192975A
Publication Date:
December 23, 2020
Filing Date:
September 30, 2015
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
H01L27/146
Domestic Patent References:
JP2004031452A | ||||
JP2000138365A | ||||
JP2000133802A | ||||
JP2005045073A | ||||
JP2009117454A | ||||
JP2004319791A | ||||
JP10223873A | ||||
JP7245386A | ||||
JP2000196063A | ||||
JP6045574A | ||||
JP2002231913A |
Foreign References:
US20130264481 | ||||
US20150200216 | ||||
US20140291493 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Yoshiki Kuroki
Kenichi Shibayama