Title:
センサ用配線基板およびセンサ装置
Document Type and Number:
Japanese Patent JP6809898
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor device with high accuracy and a wiring board for a sensor for obtaining the same.SOLUTION: A wiring board 10 for a sensor comprises: an insulation substrate 1 mounting a sensor element 3 and having a first surface 1a on which a square mounting area is provided; and wiring conductors 2 provided on a surface of and inside the insulation substrate 1. The insulation substrate 1 has recessed parts 1c at positions overlapping corner parts of the mounting area on the first surface 1a. In a sensor device 100, the recessed parts 1c are positioned under corner parts of the sensor element 3.SELECTED DRAWING: Figure 1
Inventors:
Hirokazu Hosaka
Application Number:
JP2016249414A
Publication Date:
January 06, 2021
Filing Date:
December 22, 2016
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
G01C19/5783; G01P15/08; H01L23/12; H01L29/84
Domestic Patent References:
| JP2006518673A | ||||
| JP201113175A |