Title:
パワーモジュール
Document Type and Number:
Japanese Patent JP6811310
Kind Code:
B2
Abstract:
The disclosure relates to a power module including a semiconductor component configured to be contacted on the top side and the underside. The semiconductor component is configured to be electrically contacted on the top side by a leadframe matrix by contact pressure.
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Inventors:
Michael
Neto, christophe
Schmidt, Ralph
Ronnie Werner
Neto, christophe
Schmidt, Ralph
Ronnie Werner
Application Number:
JP2019513030A
Publication Date:
January 13, 2021
Filing Date:
July 07, 2017
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| JP2006332579A | ||||
| JP9213878A | ||||
| JP5160339A | ||||
| JP2015046416A | ||||
| JP2007081155A | ||||
| JP2006093255A | ||||
| JP2002164503A | ||||
| JP2014183242A | ||||
| JP6216288A |
Attorney, Agent or Firm:
Iwao Yamaguchi
Hiroshi Yamamoto
Mina Takemoto
Hiroshi Yamamoto
Mina Takemoto