Title:
銀粒子分散液およびその製造方法並びにその銀粒子分散液を用いた導電膜の製造方法
Document Type and Number:
Japanese Patent JP6815425
Kind Code:
B2
Abstract:
There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (DSEM) of 0.15 to 0.5 μm, and the ratio (D50/DSEM) of a particle diameter (D50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (DSEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.
Inventors:
Takashi Okano
Nogami Nogami
Nogami Nogami
Application Number:
JP2019047932A
Publication Date:
January 20, 2021
Filing Date:
March 15, 2019
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F9/00; B22F1/00; B22F1/0545; B22F1/102; B22F1/145; H01B1/20; H01B13/00
Domestic Patent References:
| JP2013194169A | ||||
| JP2004100013A | ||||
| JP2013076154A | ||||
| JP2005093380A | ||||
| JP2014105371A |
Foreign References:
| WO2016166948A1 |
Attorney, Agent or Firm:
Koichi Okawa