Title:
半導体装置、大規模ＬＳＩまたは電子機器
Document Type and Number:
Japanese Patent JP6820063
Kind Code:
B2
Abstract:
To efficiently dissipate heat generated from a device.SOLUTION: A semiconductor device comprises a device such as a semiconductor bare chip, a packaged electronic component, and a passive component. In the vicinity of a device 1, for example, a support 2 formed of a material having good thermal conductivity is disposed. The device 1 and the support 2 are surrounded by a flexible circuit board 3. As a specific structure in which the flexible circuit board 3 surrounds at least a part of the device 1 and the support 2, for example, a structure in which the device 1 and the support 2 are enclosed by a single flexible circuit board 3 is adopted. The support 2 has a first support surface 4 and a second support surface 5.SELECTED DRAWING: Figure 1
Inventors:
Yasuaki Masuda
Application Number:
JP2018046016A
Publication Date:
January 27, 2021
Filing Date:
March 13, 2018
Export Citation:
Assignee:
NEC Platforms, Ltd.
International Classes:
H01L23/12; H01L23/34
Domestic Patent References:
| JP2012151173A | ||||
| JP2004172322A | ||||
| JP2007251225A | ||||
| JP2012069743A |
Foreign References:
| WO2011043493A1 | ||||
| WO2007086481A1 |
Attorney, Agent or Firm:
Sumio Tanai
Ryuichiro Mori
Yasushi Matsunuma
Eisuke Ito
Ryuichiro Mori
Yasushi Matsunuma
Eisuke Ito