Title:
ハンダ移送装置
Document Type and Number:
Japanese Patent JP6832002
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a solder transfer device that is able to easily and securely insert a linear solder into a solder transfer passage even in a case where a linear solder of small linear diameter is used.SOLUTION: A solder transfer device having: a solder inlet 10 and a solder outlet 11; a solder transfer passage 12 connecting the solder inlet 10 and the solder outlet 11 in a straight line; and a transfer mechanism 13 for transferring a linear solder 5 along the solder transfer passage 12, further has: a body 20; and a cover 22 attached to a cover attaching surface 21 of the body 20 so as to be freely detached. In the body 20, a transfer-passage formation groove 31, forming the solder transfer passage 12, is formed so as to open in the cover attaching surface 21. In the cover 22, a transfer-passage formation wall 46 is formed, which fits in the transfer-passage formation groove 31 and whose leading end extends to a position in the proximity of the bottom of the transfer-passage formation groove 31. The solder transfer passage 12 is defined by the transfer-passage formation groove 31 and the transfer-passage formation wall 46.SELECTED DRAWING: Figure 7
Inventors:
Kakisako Takuma
Application Number:
JP2017011551A
Publication Date:
February 24, 2021
Filing Date:
January 25, 2017
Export Citation:
Assignee:
Japan Unix Co., Ltd.
International Classes:
B23K3/06
Foreign References:
| US20020179680 |
Attorney, Agent or Firm:
Hayashi Naoki
Hiroshi Hayashi
Toru Ishikawa
Hiroshi Hayashi
Toru Ishikawa