Title:
状態検出方法
Document Type and Number:
Japanese Patent JP6837395
Kind Code:
B2
Abstract:
According to the invention there is provided a method of detecting a condition associated with a final phase of a plasma dicing process comprising the steps of:
providing a non-metallic substrate having a plurality of dicing lanes defined thereon;
plasma etching through the substrate along the dicing lanes, wherein during the plasma etching infrared emission emanating from at least a portion of the dicing lanes is monitored so that an increase in infrared emission from the dicing lanes is observed as the final phase of the plasma dicing operation is entered; and
detecting the condition associated with the final phase of the plasma dicing from the monitored infrared emission.
Inventors:
Oliver Jay Ansel
David A Tossell
Martin honey
David A Tossell
Martin honey
Application Number:
JP2017130351A
Publication Date:
March 03, 2021
Filing Date:
July 03, 2017
Export Citation:
Assignee:
SPTS Technologies Limited
International Classes:
H01L21/301; H01L21/3065
Domestic Patent References:
JP2017500740A | ||||
JP2017515316A | ||||
JP2015177111A | ||||
JP2013084999A |
Foreign References:
US6174407 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office