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Patent Searching and Data


Title:
マイクロニードルパッチアプリケータ及びそのハウジング
Document Type and Number:
Japanese Patent JP6840389
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a microneedle patch applicator and a microneedle patch applicator housing, whereby perpendicular penetration properties of the needle into skin are enhanced. A microneedle patch applicator housing (11) has a flat peripheral base part (12) configured from a single sheet or film, and a protruding part (13) which is surrounded by the peripheral base part and bulges perpendicularly upward toward a top surface from a bottom surface with respect to the peripheral base part. A bottom-surf ace portion of the protruding part (13) constitutes part of a microneedle patch support surface (42). The protruding part (13) is provided with a plurality of recessed fold parts (24), and the recessed fold parts (24) have recess bottoms oriented in the direction away from a center part of the protruding part (13).

Inventors:
Katsunori Kobayashi
Hidetoshi Hamamoto
Application Number:
JP2017558162A
Publication Date:
March 10, 2021
Filing Date:
December 20, 2016
Export Citation:
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Assignee:
Medrex Co., Ltd.
International Classes:
A61M37/00
Domestic Patent References:
JP2010516337A
Foreign References:
US20090198189
US20080195035
Attorney, Agent or Firm:
Takuji Yamada