Title:
シールドされた基板対基板コネクタ
Document Type and Number:
Japanese Patent JP6840840
Kind Code:
B2
Abstract:
A board-to-board connector (1) for connecting printed boards (2, 3) to each other comprises : a receptacle (10) comprising a plurality of signal contact elements (12) to be electrically connected to one of the printed boards (2), and a plug (20) comprising a plurality of signal contact elements (22) to be electrically connected to the other of the printed boards (3), the signal contact elements (22) being configured so that each of the signal contact elements (22) of the plug (20) is in contact with the corresponding signal contact element (12) of the receptacle (10) when the plug (20) has been inserted into the receptacle (10). The receptacle (10) comprises an electromagnetic interference shield (13) which continuously or discontinuously surrounds the plurality of signal contact elements (12) of the receptacle (10), and the plug (20) comprises an electromagnetic interference shield (23) which continuously or discontinuously surrounds the plurality of signal contact elements (22) of the plug (20). The shield (13) of the receptacle (10) and the shield (23) of the plug (20) are in direct contact with each other, the contact arrangement being provided along the entire perimeter of the connector (1).
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Inventors:
Hiromitsu Kodama
Application Number:
JP2019515468A
Publication Date:
March 10, 2021
Filing Date:
September 19, 2016
Export Citation:
Assignee:
Huawei Technologies Company Limited
International Classes:
H01R13/658; H01R12/72
Domestic Patent References:
| JP200659589A | ||||
| JP9237655A | ||||
| JP201666477A |
Foreign References:
| US5921814 | ||||
| US20060063432 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Keiji Kiuchi
Keiji Kiuchi