Title:
塗布処理装置及び塗布液捕集部材
Document Type and Number:
Japanese Patent JP6841188
Kind Code:
B2
Abstract:
A coating processing apparatus includes: a substrate holding part for horizontally holding a substrate and configured to rotate around a vertical axis; a coating liquid supply part for supplying a coating liquid onto the substrate; a cup body surrounding the substrate; an annular exhaust path formed along a circumferential direction of the cup body between an inner peripheral surface of the cup body and an inner member installed inside the cup body; a coating liquid collecting member installed to cover the exhaust path and having an opening, and configured to collect the coating liquid scattering from the substrate; at least one solvent storage portion formed in the coating liquid collecting member and configured to store a first solvent for dissolving the coating liquid collected in the coating liquid collecting member; and a solvent supply part for supplying the first solvent to the at least one solvent storage portion.
Inventors:
Ryoichi Uemura
Application Number:
JP2017164762A
Publication Date:
March 10, 2021
Filing Date:
August 29, 2017
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; B05C11/08; B05C11/10
Domestic Patent References:
| JP3175893U | ||||
| JP2016184644A | ||||
| JP10296162A | ||||
| JP2006086204A | ||||
| JP2014157984A |
Foreign References:
| US5705223 |
Attorney, Agent or Firm:
Patent Corporation Yayoi Patent Office
Toshio Inoue
Tomoaki Miida
Toshio Inoue
Tomoaki Miida