Title:
凹部フィーチャ内での膜のボトムアップ式付着のための方法
Document Type and Number:
Japanese Patent JP6842616
Kind Code:
B2
Abstract:
Embodiments of the invention provide a processing method for bottom-up deposition of a film in a recessed feature. According to one embodiment, the method includes a) providing a substrate containing a recessed feature having a bottom and a sidewall, b) depositing a film on the bottom and on the sidewall of the recessed feature, and c) covering the film at the bottom of the recessed feature with a mask layer. The method further includes d) etching the film from the sidewall, and e) removing the mask layer to expose the film at the bottom of the recessed feature. Steps b)-e) may be repeated at least once until the film at the bottom of the recessed feature has a desired thickness. In one example, the recessed feature may be filled with the film.
Inventors:
Tapilly, Kandabara N.
Omera, David El.
Kumar, Kausik A.
Omera, David El.
Kumar, Kausik A.
Application Number:
JP2018515543A
Publication Date:
March 17, 2021
Filing Date:
September 22, 2016
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; H01L21/768
Foreign References:
| US20120295427 | ||||
| US20050112839 | ||||
| WO2014204812A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki