Title:
２つの基板をボンディングするための装置および方法
Document Type and Number:
Japanese Patent JP6843232
Kind Code:
B2
Abstract:
A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.
Inventors:
Marks Vimpinger
Florian quats
Fiorel dragois
Florian quats
Fiorel dragois
Application Number:
JP2019512888A
Publication Date:
March 17, 2021
Filing Date:
September 29, 2016
Export Citation:
Assignee:
Afau Group A Tarner Gamebehr
International Classes:
H01L21/02; H01L21/683
Domestic Patent References:
| JP2010118483A | ||||
| JP2013120901A | ||||
| JP2015515151A | ||||
| JP2017168473A |
Foreign References:
| CN105960706A | ||||
| US20150318260 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima