Title:
研磨装置
Document Type and Number:
Japanese Patent JP6852034
Kind Code:
B2
Abstract:
A polishing device is provided with an expandable or contractible polishing body. The polishing device is further provided with a polishing mechanism that includes: a pressing force applying mechanism that applies a pressing force to the polishing body; and a supporting body that supports the pressing force applying mechanism. Moreover, the pressing force applying mechanism is configured to include an advancing or retracting section capable of advancing or retracting, and a swinging section provided in a swingable manner to a tip of the advancing or retracting section, the tip facing the polishing body.
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Inventors:
Daisuke Nakazono
Naoki Takahashi
Hidetoshi Imanishi
Naoki Takahashi
Hidetoshi Imanishi
Application Number:
JP2018194182A
Publication Date:
March 31, 2021
Filing Date:
October 15, 2018
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B24B21/00; B24B21/12; B24B21/16; B24B21/20; B24B21/22
Domestic Patent References:
| JP2004022733A |
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Toru Sekiguchi
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Toru Sekiguchi