Title:
球状銀粉およびその製造方法
Document Type and Number:
Japanese Patent JP6857166
Kind Code:
B2
Abstract:
There are provided a spherical silver powder which has the same diameter as that of a spherical silver powder produced by a conventional wet reduction method and which can sufficiently sinter the silver particles thereof to cause the silver particles to be adhered to each other at a relatively low temperature to form a conductive film having a low volume resistivity when it is used for a baked type conductive paste, and a method for producing the same. A spherical silver powder, which contains a neutral or basic amino acid having a carbon number of not less than 5 in each of particles thereof and which has an average particle diameter D50of 0.2 to 5 µm based on a laser diffraction method, is produced by adding the neutral or basic amino acid having the carbon number of not less than 5 (such as proline, tyrosine, tryptophan, phenylalanine, arginine or histidine) to a water reaction system containing silver ions to mix a reducing agent therewith to deposit silver particles by reduction.
Inventors:
Masaya Osako
Application Number:
JP2018232210A
Publication Date:
April 14, 2021
Filing Date:
December 12, 2018
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F9/24; B22F1/065; H01B1/02; H01B1/22; H01B5/00; H01B13/00; B22F1/05; B22F1/102
Domestic Patent References:
| JP2011021252A | ||||
| JP2012214873A | ||||
| JP2008255370A |
Attorney, Agent or Firm:
Koichi Okawa