Title:
組立装置及び組立品の製造方法
Document Type and Number:
Japanese Patent JP6859174
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce a size of an assembly apparatus.SOLUTION: An assembly apparatus includes a metal mold having a rotary platen 111 and a mold 12 facing the rotary platen 111. The rotary platen 111 is rotatable, and has a plurality of molding parts 141, 142, 143 and 144. The mold 12 has a plurality of molding parts 181, 182, 183 and 184, and an assembly part 191. The rotary platen 111 is rotated so that each of the molding parts 141 to 144 face each of the components 181 to 184, and a cavity for molding a component is formed of each of the molding parts 141 and 144 and each of the molding parts 181 to 184 by mold-closing operation of the metal mold. The rotary platen 111 is rotated so that any one of the molding parts 141 to 144 faces the assembly part 191, the components held in the molding parts 141 to 144 is supplied to the assembly part 191 by the mold-closing operation of the metal mold, and the assembly is assembled.SELECTED DRAWING: Figure 3
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Inventors:
Nobuharu Hoshi
Konishi Takashi
Junichi Matsumura
Mountain Saki Toshiki
Suzuki Yo
Konishi Takashi
Junichi Matsumura
Mountain Saki Toshiki
Suzuki Yo
Application Number:
JP2017087680A
Publication Date:
April 14, 2021
Filing Date:
April 26, 2017
Export Citation:
Assignee:
Canon Inc
International Classes:
B29C45/33; B29C33/34; B29C45/17
Domestic Patent References:
| JP2005534526A | ||||
| JP2102012A | ||||
| JP11138584A | ||||
| JP2000313030A |
Attorney, Agent or Firm:
Chikajima International Patent Office