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Title:
防カビ樹脂フィルム、防カビ積層フィルム及び防カビ包装体
Document Type and Number:
Japanese Patent JP6859801
Kind Code:
B2
Abstract:
To provide an antifungal package which can maintain freshness of a non-heated food product such as vegetables and fruits and is excellent in a suppression effect on generation of mold, and to provide an antifungal resin film and an antifungal laminated film which suitably constitute the antifungal package.SOLUTION: The antifungal laminated film 1 is provide in which an antifungal resin film 12 is arranged between a first resin layer 11 and a second resin layer 13, the antifungal resin film 12 includes an antifungal agent containing a compound represented by formula (1) or its salt as an active ingredient and a resin, and the antifungal laminated film 1 has a through-hole 14 having an average diameter of 8,000 μm or less and a water vapor permeation amount under an atmosphere at 40°C and 90% RH of 5 g/mday or more.SELECTED DRAWING: Figure 1

Inventors:
Akira Otsuki
Hayada Midori
Takayo Mizozoe
Application Number:
JP2017065602A
Publication Date:
April 14, 2021
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
A01N25/34; A01N31/14; A01P3/00; B32B27/18; B32B27/32; B32B27/40; B65D65/40; B65D81/24; B65D85/50; C08K5/06; C08L75/04
Domestic Patent References:
JP2016193759A
JP10217381A
JP11170444A
JP2013523992A
JP2009084182A
JP2009502848A
JP2085181A
JP11245343A
JP11293118A
Attorney, Agent or Firm:
Sumio Tanai
Masato Iida
Naoshi Fukuhara