Title:
熱伝導性フィラーおよび透明熱伝導性樹脂組成物
Document Type and Number:
Japanese Patent JP6860287
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive filler which gives a resin composition having both high transparency and thermal conductivity, and to provide a transparent thermally conductive resin composition comprising the same.SOLUTION: There are provided: the thermally conductive filler in which a refractive index control layer is provided on the surface of thermally conductive particles; and the resin composition containing the filler. The refractive index control layer preferably contains at least one element of Si and Al, and the thickness of the refractive index control layer is preferably in the range of 0.05-1 μm. The average particle diameter of the thermally conductive particles is preferably in the range of 0.5-100 μm.SELECTED DRAWING: None
Inventors:
Takahiro Nakajima
Application Number:
JP2015206839A
Publication Date:
April 14, 2021
Filing Date:
October 21, 2015
Export Citation:
Assignee:
Kri Co., Ltd.
International Classes:
C08L101/00; C08K9/02; C09K5/14
Domestic Patent References:
| JP2014077117A | ||||
| JP2010205863A | ||||
| JP2006241248A | ||||
| JP2012122082A | ||||
| JP2014145012A | ||||
| JP2012144595A |