Title:
装置の作製方法
Document Type and Number:
Japanese Patent JP6866066
Kind Code:
B2
Abstract:
A wiring having excellent electrical characteristics is provided. A wiring having stable electrical characteristics is provided. A device is manufactured through the steps of forming a first insulating film over a substrate, forming a second insulating film over the first insulating film, removing part of the first insulating film and part of the second insulating film to form a first opening, forming a first conductor in the first opening and over a top surface of the second insulating film, and forming a second conductor by planarizing a surface of the first conductor so as to remove part of the first conductor.
Inventors:
Hidekazu Miyairi
Tomoaki Moriwaka
Tomoaki Moriwaka
Application Number:
JP2016018620A
Publication Date:
April 28, 2021
Filing Date:
February 03, 2016
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/768; G09F9/30; H01L21/28; H01L21/336; H01L23/522; H01L29/417; H01L29/423; H01L29/49; H01L29/786; H01L29/788; H01L29/792
Domestic Patent References:
| JP2000012686A | ||||
| JP2010056227A | ||||
| JP2013110360A | ||||
| JP2014187378A | ||||
| JP2010062378A |