Title:
基板切断用スクライブヘッド回転装置
Document Type and Number:
Japanese Patent JP6875719
Kind Code:
B2
Abstract:
The present invention relates to a device for rotating a scribe head for substrate cutting. The device for rotating the scribe head for substrate cutting is provided with a dedicated motor for axial rotation of the scribe head, and thus is capable of performing precise and agile operation. As a result, it is capable of forming a scribe line with accuracy and speed, which results in a significant working efficiency improvement. The device for rotating the scribe head for substrate cutting includes: a main body; a vertical guider fixed to the main body and providing a vertical guide path; a lifting unit supported by the vertical guider to be capable of lifting and having the scribe head in its lower portion; lifting means lifting the lifting unit in a vertical direction; a head operating motor pressed downward and moving toward the scribe head when the lifting unit is lifted in a state where it is elastically supported by the lifting unit; and a motor pressing unit pressing the head operating motor downward to the scribe head side.
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Inventors:
Money
Application Number:
JP2016234681A
Publication Date:
May 26, 2021
Filing Date:
December 02, 2016
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; C03B33/027
Domestic Patent References:
| JP2015093487A | ||||
| JP2012061623A | ||||
| JP7223829A |