Title:
研磨剤、研磨剤用貯蔵液及び研磨方法
Document Type and Number:
Japanese Patent JP6878772
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polisher that can remove resin at a high polishing rate while preventing polishing scratches.SOLUTION: A polisher for resin polishing contains an abrasive grain and water. The abrasive grain has a positive charge in the polisher. The abrasive grain includes a particle attached with at least one selected from the group consisting of an aluminum compound and an aluminum ion (excluding a particle composed of alumina). The polisher has the pH of 3.0-7.0.SELECTED DRAWING: None
Inventors:
Masano Hanano
Nao Yamamura
Haruaki Sakurai
Mizutani Masato
Hiroshi Ono
Nao Yamamura
Haruaki Sakurai
Mizutani Masato
Hiroshi Ono
Application Number:
JP2016081282A
Publication Date:
June 02, 2021
Filing Date:
April 14, 2016
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP2003124160A | ||||
| JP2000351957A | ||||
| JP2003224092A | ||||
| JP2018533071A |
Foreign References:
| WO2015047970A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Furoshita
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Furoshita