Title:
構造化低密度パリティチェック（ＬＤＰＣ）コードのパンクチャリング
Document Type and Number:
Japanese Patent JP6883033
Kind Code:
B2
Abstract:
Certain aspects of the present disclosure generally relate to techniques for puncturing of structured low density parity check (LDPC) codes. A method for wireless communications by wireless node is provided. The method generally includes encoding a set of information bits based on a LDPC code to produce a code word, the LDPC code defined by a matrix having a first number of variable nodes and a second number of check nodes, puncturing the code word to produce a punctured code word, wherein the puncturing is performed according to a first puncturing pattern designed to puncture bits corresponding to one or more of the variable nodes having a certain degree of connectivity to the check nodes, and transmitting the punctured code word.
Inventors:
Shrinivas Decal
Se Young Park
Alexandros Manoracos
Krishna Kiran Mukkavili
Vincent Ronke
Joseph Vinamira Soriaga
Jin Jiang
Thomas Joseph Richardson
Se Young Park
Alexandros Manoracos
Krishna Kiran Mukkavili
Vincent Ronke
Joseph Vinamira Soriaga
Jin Jiang
Thomas Joseph Richardson
Application Number:
JP2018523786A
Publication Date:
June 02, 2021
Filing Date:
August 23, 2016
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
H03M13/19; H04L1/00
Domestic Patent References:
| JP2011514049A |
Foreign References:
| WO2014127129A1 | ||||
| US20070101243 | ||||
| WO2009011134A1 | ||||
| US20080126916 | ||||
| US20130051556 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei