Title:
電子部品実装装置および電子部品実装方法
Document Type and Number:
Japanese Patent JP6883728
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of adjusting transfer of a bonding material to an electronic component with a bump, according to a transfer state of the bonding material, and an electronic component mounting method.SOLUTION: An electronic component mounting device includes a board holding section for holding a board, a mounting head for holding a component and moving the component in a vertical direction, a head moving mechanism for moving the mounting head in a horizontal direction, a paste transfer section for supplying a bonding material as a coating film, and a three-dimensional camera unit 16 (component imaging camera) performing three-dimensional imaging of a component D before and after the bonding material is transferred from a lower surface side. The component before and after the bonding material is transferred is imaged by the three-dimensional camera unit 16 (ST2 and ST6), a shape of a bump including a height of the bump is extracted (ST7), an adhesion state of the bonding material is determined (ST8 and ST10), and when a determination is made that the adhesion state of the bonding material is not a prescribed state, coating of the bump with the bonding material is adjusted (ST9, ST11, and next time ST5).SELECTED DRAWING: Figure 9
Inventors:
Hideaki Kato
Akihiro Urakawa
Budissa Ahmed
Akihiro Urakawa
Budissa Ahmed
Application Number:
JP2016247927A
Publication Date:
June 09, 2021
Filing Date:
December 21, 2016
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01L21/60; B23K1/00; B23K3/06; H05K3/34; H05K13/04
Domestic Patent References:
| JP10075096A | ||||
| JP2009277971A | ||||
| JP2003158154A | ||||
| JP2015133422A | ||||
| JP2008235739A |
Foreign References:
| WO2015019447A1 |
Attorney, Agent or Firm:
Kenji Kamada
Koichi Nomura
Koichi Nomura