Title:
基板の研磨装置および研磨方法
Document Type and Number:
Japanese Patent JP6884015
Kind Code:
B2
Abstract:
Provided is a polishing device for appropriately retaining a polishing member in an appropriate state in polishing. The polishing device for partially polishing a substrate includes a polishing member having a processing surface which comes into contact with the substrate and which is smaller than the substrate, a conditioning member for performing conditioning on the polishing member, a first pressing mechanism for pressing the conditioning member against the polishing member in polishing the substrate, and a control unit for controlling an operation of the polishing device. The control unit is configured to control the first pressing mechanism when the substrate is partially polished by the polishing member.
Inventors:
Hozumi Yasuda
Takeki Kobata
Nobuyuki Takahashi
Sakukawa Takashi
Takeki Kobata
Nobuyuki Takahashi
Sakukawa Takashi
Application Number:
JP2017055976A
Publication Date:
June 09, 2021
Filing Date:
March 22, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B53/00; B24B37/005; B24B53/017; B24B53/12; B24B55/06; H01L21/304
Domestic Patent References:
| JP2001054864A | ||||
| JP2002321146A | ||||
| JP2011167813A | ||||
| JP11179648A | ||||
| JP2011177842A | ||||
| JP2010076080A | ||||
| JP11320384A | ||||
| JP63232954A |
Foreign References:
| WO2015050185A1 |
Attorney, Agent or Firm:
Toru Miyamae
Shinjiro Ono
Yukio Kanegae
Makoto Watanabe
Shinjiro Ono
Yukio Kanegae
Makoto Watanabe