Title:
光半導体装置用ダイアタッチ材
Document Type and Number:
Japanese Patent JP6884726
Kind Code:
B2
Abstract:
To provide a die attach material for an optical semiconductor device, which is composed of a thermosetting epoxy silicone compound and is excellent in stamping application work efficiency, and bond strength to a silver surface.SOLUTION: The die attach material is provided that contains the following constituents (A)-(D). (A) the following constituent (A-1) and constituent (A-2) in an amount of 40-80 pts. mass ; (A-1) polyorganosiloxane having 2 or more of epoxy groups in a molecule and (A-2) an epoxy compound or an epoxy resin having 2 or more of epoxy groups in a molecule (provided that is not polysiloxane), (B) an acid anhydride curing agent in an amount of 20-60 pts.mass, the (B) including an acid anhydride (B-1) having a bicyclo-skeleton and an acid anhydride (B-2) having a liberated carboxyl group by a mass ratio of (B-1):(B-2)=75:25-95:5 (provided that the sum of the constituent (A) and the constituent (B) is 100 pts.mass), (C) a catalytic amount of a curing catalyst, and (D) an inorganic filler in an amount of 1-20 pts.mass based on 100 pts.mass of the constituent (A) and the constituent (B).SELECTED DRAWING: None
Inventors:
Tatsuya Yamazaki
Application Number:
JP2018073315A
Publication Date:
June 09, 2021
Filing Date:
April 05, 2018
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L21/52; C08G59/20; C08G59/42; C09J163/00; H01L33/48
Domestic Patent References:
| JP2014169415A |
Foreign References:
| WO2005121202A1 | ||||
| WO2010071168A1 |
Attorney, Agent or Firm:
Mitsuo Matsui
Hiroshi Murakami
Yukari Kato
Hidefumi Kawamura
Hiroshi Murakami
Yukari Kato
Hidefumi Kawamura