Title:
エレクトロウェッティング力による液滴操作
Document Type and Number:
Japanese Patent JP6887527
Kind Code:
B2
Abstract:
One example includes a device that includes an insulator panel, a plurality of electrical inputs, and a plurality of electrodes. The plurality of electrical inputs may be disposed on the insulator panel and individually receive an actuation voltage. The plurality of electrodes may be disposed on the insulator panel and are coupled to the plurality of electrical inputs. Two or more of the plurality of electrodes may be coupled to a single one of the plurality of electrical inputs for each of the plurality of electrical inputs. The plurality of electrodes may be actuated with the actuation voltage individually received at a respective electrical input to create an electric field over associated electrodes to subject a droplet proximate to the associated electrodes actuated with the actuation voltage to an electrowetting force.
Inventors:
Cambie, Michael, W
Skolnikov, Viktor
Skolnikov, Viktor
Application Number:
JP2019557450A
Publication Date:
June 16, 2021
Filing Date:
April 21, 2017
Export Citation:
Assignee:
Hewlett-Packard Development Company
Hewlett-Packard Development Company, L.P.
Hewlett-Packard Development Company, L.P.
International Classes:
B01J19/00; G01N35/08; G01N1/00; G01N37/00
Domestic Patent References:
| JP2006125900A | ||||
| JP2006500596A |
Other References:
GUPTA, M. et al,A Scheduling and Routing Algorithm for Digital Microfluidic Ring Layouts with Bus-phase Addressing,Proceedings of the 2007 IEEE/RSJ International Conference on Intelligent Robots and Systems,米国,IEEE,2008年 2月,ThA10.4,3144-3150
Attorney, Agent or Firm:
Satoshi Furuya
Akihiro Onishi
Rei Hosoi
Akihiro Onishi
Rei Hosoi