Title:
半導体装置
Document Type and Number:
Japanese Patent JP6892360
Kind Code:
B2
Abstract:
A semiconductor device according to an embodiment includes a first memory chip having a first front surface and a first back surface and having a first memory circuit provided on the first front surface side; a second memory chip having a second front surface and a second back surface facing the first front surface, having a second memory circuit provided on the second front surface side, and being electrically connected to the first memory chip; and a logic chip having the first memory chip provided between the logic chip and the second memory chip, having a third front surface and a third back surface, having a logic circuit provided on the third front surface side, and being electrically connected to the first memory chip.
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Inventors:
Tsukiyama Kei
Yoichiro Kurita
Hideo Aoki
Kazumasa Kawasaki
Yoichiro Kurita
Hideo Aoki
Kazumasa Kawasaki
Application Number:
JP2017179328A
Publication Date:
June 23, 2021
Filing Date:
September 19, 2017
Export Citation:
Assignee:
Kioxia Co., Ltd.
International Classes:
H01L25/065; H01L23/12; H01L25/07; H01L25/18
Domestic Patent References:
| JP2010251408A | ||||
| JP2008066714A | ||||
| JP2010034436A | ||||
| JP2010087035A |
Attorney, Agent or Firm:
Tetsuma Ikegami
Akira Sudo
Masahiro Takashita
Mitsuyuki Matsuyama
Akira Sudo
Masahiro Takashita
Mitsuyuki Matsuyama