Title:
圧力センサアセンブリ
Document Type and Number:
Japanese Patent JP6895549
Kind Code:
B2
Abstract:
A pressure sensor assembly for use in sensing a pressure of a process fluid in a high temperature environment includes an elongate sensor housing configured to be exposed to the process fluid and having a cavity formed therein. A pressure sensor is positioned in the cavity of the elongate sensor housing. The pressure sensor has at least one diaphragm that deflects in response to applied pressure and includes an electrical component having an electrical property which changes as a function of deflection of the at least one diaphragm which is indicative of applied pressure. A flexible membrane in contact with the at least one diaphragm is disposed to seal at least a portion of the cavity of the sensor housing from the process fluid and flexes in response to pressure applied by the process fluid to thereby cause deflection of the at least one diaphragm.
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Inventors:
Andrew, David, Alexander
Stray, David, Matthew
Stray, David, Matthew
Application Number:
JP2019571939A
Publication Date:
June 30, 2021
Filing Date:
April 03, 2018
Export Citation:
Assignee:
Rosemount Incorporated
International Classes:
G01L19/06; G01L9/12
Domestic Patent References:
| JP2011252739A | ||||
| JP2011117783A | ||||
| JP2008164326A |
Foreign References:
| US3895524 |
Attorney, Agent or Firm:
Kiyotaka Sakamoto
Sanji Tanabe
Sanji Tanabe