Title:
加工装置
Document Type and Number:
Japanese Patent JP6901920
Kind Code:
B2
Abstract:
To make it possible to measure the thickness of a work-piece without using a measuring device independently of a processing device.SOLUTION: An image of a subject and scale 810 indicating a raising and lowering range of a condenser lens composing imaging means are displayed in a scale display area 81 of a touch panel 8, the condenser lens is raised or lowered according to an operator instruction on the scale 810, thereby focusing the condenser lens. The height position of the condenser lens at the time is displayed in a height position display area 812 of the touch panel 8 and the height of the upper surface of the subject is measured. Accordingly, the thickness of a work-piece can be measured, eliminating the need to provide a measuring device independently of a processing device.SELECTED DRAWING: Figure 6
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Inventors:
Shinya Chiba
Katsuji Negishi
Katsuji Negishi
Application Number:
JP2017133680A
Publication Date:
July 14, 2021
Filing Date:
July 07, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23Q17/24; B23Q17/00; B24B27/06; B24B49/12; G01B11/02; H01L21/301
Domestic Patent References:
| JP2015020240A | ||||
| JP2008004885A | ||||
| JP10039912A | ||||
| JP2009182060A |
Foreign References:
| US6357330 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office