Title:
有機ケイ素化合物、その製造方法および硬化性組成物
Document Type and Number:
Japanese Patent JP6907877
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide an organosilicon compound which is effective as a resin modifier or the like of a high frequency substrate material. The organosilicon compound of the present invention is represented by average structural formula (1) in which X indicates an n-valent organic group having a polyphenylene ether structure, R^1 each independently indicates an unsubstituted or substituted C_1-C_10 alkyl group or an unsubstituted or substituted C_6-C_10 aryl group, R^2 each independently indicates an unsubstituted or substituted C_1-C_10 alkyl group or an unsubstituted or substituted C_6-C_10 aryl group, R^7 each independently indicates a monovalent hydrocarbon group containing a polymerizable reactive group, A^1 each independently indicates a divalent linking group which contains a single bond or a hetero atom, A^2 each independently indicates an unsubstituted or substituted C_1-C_20 divalent hydrocarbon group which does not contain a single bond or a hetero atom, m is a number of 1 to 3, p is a number of 1 to 10, q is a number of 1 to 10, n = p+q, and n is a number of 2 to 20.
Inventors:
Tetsuro Yamada
Hirokami Souna
Hirokami Souna
Application Number:
JP2017204946A
Publication Date:
July 21, 2021
Filing Date:
October 24, 2017
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G65/48
Domestic Patent References:
| JP5163344A | ||||
| JP2013001772A | ||||
| JP2009029928A | ||||
| JP2006213876A | ||||
| JP2003155340A | ||||
| JP2004339328A | ||||
| JP2007321130A |
Attorney, Agent or Firm:
Hideaki International Patent Office