Title:
研磨用組成物及びその製造方法
Document Type and Number:
Japanese Patent JP6914915
Kind Code:
B2
Abstract:
Provided is a polishing composition which renders smoothness with higher accuracy possible. The polishing composition includes abrasive grains and a basic compound and further contains a water-soluble high-molecular-weight compound and a product of a reaction of a polymerization initiator with a polymerization inhibitor. Due to the reaction product, higher smoothness is attained.
Inventors:
Takayuki Takemoto
Naohiko Saito
Michihiro Kawai
Kosuke Tsuchiya
Tansho Hisanori
Yusuke Suga
Daiki Ichitsubo
Naohiko Saito
Michihiro Kawai
Kosuke Tsuchiya
Tansho Hisanori
Yusuke Suga
Daiki Ichitsubo
Application Number:
JP2018509212A
Publication Date:
August 04, 2021
Filing Date:
March 23, 2017
Export Citation:
Assignee:
Toagosei Co., Ltd.
Fujimi Incorporated Co., Ltd.
Fujimi Incorporated Co., Ltd.
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP2015078318A | ||||
| JP2017011220A | ||||
| JP2016213216A |
Foreign References:
| WO2015068672A1 | ||||
| WO2015053207A1 |
Attorney, Agent or Firm:
Kaiyu International Patent Office