Title:
プリント配線板の製造方法
Document Type and Number:
Japanese Patent JP6919688
Kind Code:
B2
Abstract:
The present invention provides a method for producing a printed-wiring board in a semi-additive process, comprising the steps of: providing a chemical copper plating 4 on an insulation layer 3 or forming a copper thin film on the insulation layer 3 using a sputtering method; subjecting the obtained copper surface 4 to a roughening treatment using an etching solution containing 0.1 to 3% by mass of hydrogen peroxide, 0.3 to 5% by mass of sulfuric acid, 0.1 to 3 ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles; attaching a dry film resist 5 to the copper surface 4 after the roughening treatment to perform exposure and development and providing an electrolytic copper plating 7 to an opening 6 after the exposure; and subjecting the remaining dry film resist to a stripping treatment using a resist stripping liquid containing 0.5 to 20% by mass of monoethanolamine, 0.2 to 10% by mass of quaternary ammonium hydroxide, 0.01 to 10% by mass of ethylene glycols and 0.01 to 0.5% by mass of azoles.
Inventors:
Kenichi Takahashi
Kazuhiko Ikeda
Kazuhiko Ikeda
Application Number:
JP2019164385A
Publication Date:
August 18, 2021
Filing Date:
September 10, 2019
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
H05K3/18; C23F1/00; C23F1/18
Domestic Patent References:
| JP2003003283A | ||||
| JP2007173300A | ||||
| JP2006013340A |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Kyoei Sugiyama
Kyoko Tamura
Yasuhito Suzuki
Kyoei Sugiyama
Kyoko Tamura
Yasuhito Suzuki