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Title:
超音波デバイスユニット、超音波探触子、及び超音波装置
Document Type and Number:
Japanese Patent JP6922300
Kind Code:
B2
Abstract:
An ultrasonic device unit includes an ultrasonic device, and a flexible printed wiring board to be connected to the ultrasonic device, the flexible printed wiring board is provided with a device connection to which the ultrasonic device is connected, a first connector including external connection terminals to be connected to the ultrasonic device, a second connector including external connection terminals to be connected to the ultrasonic device, a first inflective part adapted to link the device connection and the first connector to each other, and a second inflective part adapted to link the device connection and the second connector to each other, and a distance between the device connection and the first connector in the first inflective part and a distance between the device connection and the first connector in the second inflective part are different from each other.

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Inventors:
Kazuki Yoshida
Application Number:
JP2017055390A
Publication Date:
August 18, 2021
Filing Date:
March 22, 2017
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
H04R17/00; A61B8/14; H04R1/06
Domestic Patent References:
JP2013172799A
Attorney, Agent or Firm:
Intellectual Property Office