Title:
固体蛍光体集積光源のデュアルチャンネル伝熱パッケージング構造及びパッケージング方法
Document Type and Number:
Japanese Patent JP6923941
Kind Code:
B2
Abstract:
A dual-channel heat-conducting encapsulation structure of a solid-state phosphor integrated light source has a solid-state phosphor, a transparent organic silica gel, LED chips and a substrate. The LED chips are arranged on the substrate. The dual-channel heat-conducting encapsulation structure also has heat-conducting columns fixed on the substrate, and the heat-conducting columns are disposed away from the LED chips; the solid-state phosphor is placed on the heat-conducting columns without contacting the LED chips; the transparent organic silica gel is filled in the gap between the solid-state phosphor and the substrate. By adopting the design of double heat-conducting channels, separates two heat sources of the LED light source to sufficiently conduct the heat, the heat of the solid-state phosphor and the LED chips reaches the substrate through the respective channels, and then is transferred from the substrate through the heat sink into the atmosphere.
Inventors:
Naoki Kano
Zhang Jie
Hongmo Tsubaki
Fumio Hayashi
Guowang
Zhang Yunfeng
Zhang Jie
Hongmo Tsubaki
Fumio Hayashi
Guowang
Zhang Yunfeng
Application Number:
JP2018521966A
Publication Date:
August 25, 2021
Filing Date:
June 08, 2016
Export Citation:
Assignee:
Fujian Zhongyuan Core Technology Co., Ltd.
International Classes:
H01L33/64; F21V3/00; F21V3/08; F21V9/32; F21V19/00; F21V29/10; F21V29/502; F21V29/503; G02B5/20; H01L33/50; H01L33/56; H01L33/60
Domestic Patent References:
| JP2014517527A | ||||
| JP2012009470A | ||||
| JP2005005544A | ||||
| JP2014060283A | ||||
| JP2013522915A |
Foreign References:
| US20100140655 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark