Title:
樹脂組成物及びポリイミド樹脂膜
Document Type and Number:
Japanese Patent JP6926393
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in heat resistance and toughness and can form a polyimide resin film, and to provide a polyimide resin film using the same.SOLUTION: There is provided a resin composition which contains (a) a polyimide precursor and (b) an organic solvent, where (a) the polyimide precursor is a polyamic acid having a specific structural unit, where a structural unit represented by (1) is 50.0 mol% to 99.9 mol% with respect to the total of a specific diamine structural unit (1) and a specific diamine structural unit (3), and a structural unit represented by (2) is 15 mol% or more with respect to the total of a specific tetracarboxylic acid structure unit (2) and a specific tetracarboxylic acid structural unit (4).SELECTED DRAWING: None
Inventors:
Yumiko Arakawa
Atsushi Ueda
Masayuki Oe
Atsushi Ueda
Masayuki Oe
Application Number:
JP2016041462A
Publication Date:
August 25, 2021
Filing Date:
March 03, 2016
Export Citation:
Assignee:
hd micro systems inc.
International Classes:
C08G73/10; B29C41/12; C08J5/18
Domestic Patent References:
| JP61111359A | ||||
| JP2009091470A | ||||
| JP2014152221A |
Foreign References:
| WO2015094848A1 | ||||
| WO2009069797A1 | ||||
| WO2016003146A1 |
Attorney, Agent or Firm:
Heiwa International Patent Office