Title:
封止光半導体素子の製造方法
Document Type and Number:
Japanese Patent JP6928437
Kind Code:
B2
Abstract:
A manufacturing method of sealed optical semiconductor element comprises the steps of: (1) preparing a temporarily fixing member including a hard carrier, a support layer supported on the carrier and composed of a synthetic resin, and a fixed layer supported on the support layer; (2) temporarily fixing an element aggregate formed by arranging a plurality of optical semiconductor elements in a line at the fixed layer; (3) coating the plurality of optical semiconductor elements by a sealing layer to obtain a sealed element aggregate having the element aggregate and the sealing layer after performing the step (2); (4) cutting the sealing layer by way of making the sealed optical semiconductor element in single-piece after performing the step (3); and (5) peeling the sealed element aggregate from the fixed layer after performing the step (3). The support layer is provided with an alignment mark so that the alignment mark can be easily formed on the support layer and the carrier can be reused after peeled from the support. In the step (2), the element aggregate is temporarily fixed to the fixed layer by taking the alignment mark as the benchmark, and/or in the step (4), the sealing layer is cut by taking the alignment mark as the benchmark.
Inventors:
Yuki Ebe
Umeya Eihiro
Koji Noro
Yoshihiko Kitayama
Ryota Mita
Umeya Eihiro
Koji Noro
Yoshihiko Kitayama
Ryota Mita
Application Number:
JP2016205775A
Publication Date:
September 01, 2021
Filing Date:
October 20, 2016
Export Citation:
Assignee:
Nitto Denko (Shanghai Songjiang) Co., Ltd.
International Classes:
H01L33/52
Domestic Patent References:
| JP2014168036A |
Foreign References:
| WO2015198220A1 | ||||
| WO2014097645A1 | ||||
| WO2015163075A1 |
Attorney, Agent or Firm:
Hiroyuki Okamoto