Title:
プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法
Document Type and Number:
Japanese Patent JP6928924
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a releasing film for process, comprising: a capability of releasing a molded article after resin sealing without depending on a structure of a mold and an amount of a releasing agent; a capability of obtaining a molded article having no defective appearance such as wrinkles and chips; and a capability of effectively suppressing contamination of the mold.SOLUTION: There is provided a releasing film for process being a laminated film, comprising: a releasing layer A; a heat-resistant resin layer B; and optionally, a releasing layer A', and the releasing film for process has a contact angle in the releasing layer A (and optionally the releasing layer A') with respect to water of 90° to 130°, and a thermal dimensional change rate in a transverse (TD) direction of the laminated film at 23°C to 120°C is 3% or less, an oxygen permeability measured under conditions at a temperature of 20°C and at a humidity of 50% RH is 1000 mL/mday MPa or less according to JIS K7126, or an out gas permeability measured according to a predetermined procedure is 1.0% by weight or less.SELECTED DRAWING: Figure 3
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| JP2008188881 | RESIN SEALING DEVICE |
Inventors:
Masaru Shimizu
Kenji Shima
Kenji Shima
Application Number:
JP2017084715A
Publication Date:
September 01, 2021
Filing Date:
April 21, 2017
Export Citation:
Assignee:
Mitsui Chemicals Tohcello Co., Ltd.
International Classes:
B29C33/68; B32B27/00; H01L21/56
Domestic Patent References:
| JP2004322471A | ||||
| JP2006049850A | ||||
| JP2014226785A | ||||
| JP2014113703A |
Foreign References:
| WO2007125834A1 |
Attorney, Agent or Firm:
Asamura patent office