Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP6930586
Kind Code:
B2
Abstract:
An electronic component includes an electronic component main body having a mounting surface with first and second baked electrodes located thereon at locations spaced apart from one another. A recess extends into the electronic component main body in the area between the first and second baked electrodes. The recess extends over at least a part of at least one of the first and second baked electrodes.
Inventors:
Toru Yatsu
Application Number:
JP2019519542A
Publication Date:
September 01, 2021
Filing Date:
May 07, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/30; H01F27/29; H01F41/04; H01G4/228
Domestic Patent References:
| JP2001093770A | ||||
| JP2014524154A | ||||
| JP59092512A |
Foreign References:
| WO2012121141A1 | ||||
| WO2012132880A1 | ||||
| FR2529378A1 |
Attorney, Agent or Firm:
Atomi International Patent Office