Title:
研削装置、研削方法及びコンピュータ記憶媒体
Document Type and Number:
Japanese Patent JP6937370
Kind Code:
B2
Abstract:
A grinding apparatus configured to grind a substrate includes a substrate holder configured to hold the substrate; and an annular grinder configured to come into contact with at least a central portion and a peripheral portion of the substrate held by the substrate holder to grind the substrate. The substrate holder includes multiple substrate holders and the grinder includes multiple grinders. A diameter of at least one of the multiple grinders is different from a diameter of others of the multiple grinders.
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Inventors:
Takeshi Tamura
Kodama Munehisa
Kodama Munehisa
Application Number:
JP2019529067A
Publication Date:
September 22, 2021
Filing Date:
July 03, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; B24B7/00; B24B47/22; B24B49/10; B24B49/12
Domestic Patent References:
| JP2001322056A | ||||
| JP7058068A | ||||
| JP2008155292A | ||||
| JP2015019053A | ||||
| JP2014042959A | ||||
| JP2014037045A | ||||
| JP2013226625A | ||||
| JP2017007054A |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine