Title:
ＣＭＰプロセスのトラッキングデータを３Ｄ印刷されたＣＭＰ消耗材と組み合わせるための技法
Document Type and Number:
Japanese Patent JP6940497
Kind Code:
B2
Abstract:
Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
Inventors:
Fan, Jason Gee.
Badger, Rajib
Redfield, Daniel
Cana, Anildo
Cornejo, Mario
Menk, Gregory E.
John Watkins
Badger, Rajib
Redfield, Daniel
Cana, Anildo
Cornejo, Mario
Menk, Gregory E.
John Watkins
Application Number:
JP2018522976A
Publication Date:
September 29, 2021
Filing Date:
October 19, 2016
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B24B49/10; B24B37/24; H01L21/304
Domestic Patent References:
| JP2009542449A | ||||
| JP2015174272A |
Foreign References:
| US20150126099 | ||||
| WO2007086529A1 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation