Title:
積層体の製造方法および接合装置
Document Type and Number:
Japanese Patent JP6944149
Kind Code:
B2
Abstract:
To provide a manufacturing method and a bonding apparatus for a bonded body capable of bonding easily and firmly a variety of different components in a state where an adhesive layer is extremely thin.SOLUTION: A method for manufacturing a bonded body 20 in which a first component to be bonded 11 and a second component to be bonded 12 are bonded includes: a plasma treatment step 3a, 3b for performing a plasma treatment on one or both of a first bonding surface of the first component to be bonded 11 and a second bonding surface of the second component to be bonded 12; a gas treatment step 4a for a gas containing water vapor, silane coupling agent or a mixture of these materials to be adhered onto the first bonding surface and the second bonding surface which have been plasma treated; a press-bonding step 5 for forming a laminated body 19 in which the first component to be bonded and the second component to be bonded are superimposed so that the first bonding surface and the second bonding surface are brought into contact, and press-bonding it at 2.0 to 10.0 MPa; and a bonding step 7 for heating or applying electromagnetic wave to the laminated body 19.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
Koichi Tanaka
Fujisawa Hideyoshi
Tomohiro Takahashi
Tomoyuki Hayasaki
Yasunori Taga
Fujisawa Hideyoshi
Tomohiro Takahashi
Tomoyuki Hayasaki
Yasunori Taga
Application Number:
JP2017137041A
Publication Date:
October 06, 2021
Filing Date:
July 13, 2017
Export Citation:
Assignee:
Chubu University
NIPPON KAYAKU KABUSHIKI KAISHA
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
B29C65/02; B23K20/00; B29C65/14
Domestic Patent References:
| JP2015178237A |
Foreign References:
| WO2007119552A1 |
Attorney, Agent or Firm:
Ako Ogasawara