Title:
熱硬化性樹脂組成物及びその製造方法
Document Type and Number:
Japanese Patent JP6944518
Kind Code:
B2
Abstract:
The present invention provides a resin composition which has excellent handleability and which provides a cured product having excellent toughness and heat resistance. The present invention relates to a thermosetting resin composition including an allyl compound (A) containing at least two or more allyl groups and one or more benzene rings in a molecule, a maleimide compound (B) containing at least two or more maleimide groups in a molecule, a thiol compound (C) containing at least two or more thiol groups in a molecule, and a cyclic compound (D) containing at least two or more hydroxyl groups in a molecule.
Inventors:
Hiromi Kida
Atsushi Miyata
Shinji Ikeshita
Keita Kobayashi
Atsushi Miyata
Shinji Ikeshita
Keita Kobayashi
Application Number:
JP2019515386A
Publication Date:
October 06, 2021
Filing Date:
October 30, 2018
Export Citation:
Assignee:
Sakai Chemical Industry Co., Ltd.
International Classes:
C08G75/045; C08F222/40; C08J3/20
Domestic Patent References:
| JP201674902A |
Attorney, Agent or Firm:
Atomi International Patent Office