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Title:
はく離フィルムの製造方法、及びセラミック部品シートの製造方法
Document Type and Number:
Japanese Patent JP6947286
Kind Code:
B2
Abstract:
The present invention provides a release film comprising a base material and a release layer provided over the base material, wherein the release layer is a cured product of a composition containing a silicone resin having a reactive functional group and other polymerizing ingredients, and, as measured by XPS, when X is the silicon peak intensity for the surface of the release layer on the side facing away from the base material side, Y is the silicon peak intensity at a depth of 4.1 nm from said surface of the release layer, and Z is the silicon peak intensity measured when a silicone resin layer containing 90% or more polydimethylsiloxane has been formed, X is greater than Y, the ratio of X to Z is 40% or greater, and the ratio of Y to Z is 5 to 50%.

Inventors:
Tomoki Yuda
Mas Oyama
山▲崎▼ 勝彦
Akinori Nishizawa
Shuji Iida
Application Number:
JP2020506379A
Publication Date:
October 13, 2021
Filing Date:
October 11, 2019
Export Citation:
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Assignee:
tdk Corporation
International Classes:
B32B27/28; B28B1/30; B32B27/00; B32B27/30
Domestic Patent References:
JP2010105384A
JP2008133435A
Foreign References:
WO2013129080A1
WO2018159247A1
WO2016060084A1
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami