Title:
基板分断装置
Document Type and Number:
Japanese Patent JP6949371
Kind Code:
B2
Abstract:
To maintain high parallelism of a break bar to a substrate in a substrate cutting device which changes the extending direction of the break bar by rotation in order to cut the substrate on which a plurality of scribe lines orthogonal to one another are formed.SOLUTION: A break bar 19 is a member capable of dividing a substrate by moving downward from a base 22 and includes a base member 21 removably supported by the base, and a bar member 23 connected to the base member for contacting the substrate. A second slide drive mechanism moves the base in a first horizontal direction. A first slide drive mechanism moves the base 22 in a second horizontal direction orthogonal to the first horizontal direction. A rotation mechanism rotates the break bar between a first posture extending in the first horizontal direction and a second posture extending in the second horizontal direction with respect to the base. An inclination adjustment mechanism 27 can adjust an inclination of the bar member by vertically moving at least one of both ends of the bar member with respect to the base member.SELECTED DRAWING: Figure 3
Inventors:
Katsuki Nakata
Hiragichi Tanigaki
Hiragichi Tanigaki
Application Number:
JP2017240712A
Publication Date:
October 13, 2021
Filing Date:
December 15, 2017
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; B26F3/00; C03B33/033; H01L21/301
Domestic Patent References:
| JP201419044A | ||||
| JP201739272A | ||||
| JP201052332A | ||||
| JP3192753A | ||||
| JP200439931A |
Foreign References:
| US20050121486 | ||||
| DE10311693B3 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation