Title:
超音波探傷装置
Document Type and Number:
Japanese Patent JP6950152
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve detection sensitivity.SOLUTION: An ultrasonic flaw detection device comprises: an array probe 110 that is configured to include a transmission unit 120 composed of a plurality of oscillators transmitting an ultrasonic to an interior of an inspection object 10, and a reception unit 130 composed of the plurality of oscillators receiving the ultrasonic reflected inside the inspection object 10; and a delay material 150 that is disposed between the inspection object 10 and the array probe 110, and has a first layer 170, and a second layer 180 disposed on an array probe 110 side relative to the first layer 170, and composed of a substance having an ultrasonic propagation velocity different from that of the first layer 170.SELECTED DRAWING: Figure 4
Inventors:
Naoyuki Tamura
Akinori Tsuda
Hiroaki Hatanaka
Noriko Saito
Akinori Tsuda
Hiroaki Hatanaka
Noriko Saito
Application Number:
JP2016133872A
Publication Date:
October 13, 2021
Filing Date:
July 06, 2016
Export Citation:
Assignee:
Ihi Co., Ltd.
International Classes:
G01N29/28; H04R23/00
Domestic Patent References:
| JP6019341B2 | ||||
| JP4278457A | ||||
| JP46005637B1 | ||||
| JP2008216125A | ||||
| JP2003175037A |
Foreign References:
| US4976150 |
Attorney, Agent or Firm:
Aomi patent office