Title:
電子モジュール
Document Type and Number:
Japanese Patent JP6952042
Kind Code:
B2
Abstract:
An electronic module has a first substrate 11, a first conductor layer 12 that is provided on one side of the first substrate 11, a first electronic element 13 that is provided on one side of the first conductor layer 12, a second electronic element 23 that is provided on one side of the first electronic element 23, and a second connecting body 70 that has a second head part 71 provided on one side of the second electronic element 23 and an extending part 75 extending from the second head part 71 to the other side and abutting against the first substrate 11 or the first conductor layer 12.
Inventors:
Kosuke Ikeda
Matsuri
Matsuri
Application Number:
JP2018538251A
Publication Date:
October 20, 2021
Filing Date:
May 19, 2017
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L23/48; H01L25/04; H01L25/18
Domestic Patent References:
| JP200293977A | ||||
| JP2012248658A | ||||
| JP201672575A | ||||
| JP2010245212A | ||||
| JP2011142172A |
Foreign References:
| US20110298114 |
Attorney, Agent or Firm:
Seiji Ohno
Hiroyuki Ohno
Hiroyuki Ohno